Assignee
CHIPSCALE INC
US·14 granted patents·724 citations·filing 1994–2004
Top patents by PatentIndex Score
14 records- 0195US6221751B1Wafer fabrication of die-bottom contacts for electronic devicesCHIPSCALE INC·Filed 1998·Granted Apr 24, 2001·203 cites·44 claims
- 0295US5910687AWafer fabrication of die-bottom contacts for electronic devicesCHIPSCALE INC·Filed 1997·Granted Jun 8, 1999·198 cites·44 claims
- 0388US6051489AElectronic component package with posts on the active side of the substrateCHIPSCALE INC·Filed 1997·Granted Apr 18, 2000·97 cites·38 claims
- 0477US5557149ASemiconductor fabrication with contact processing for wrap-around flange interfaceCHIPSCALE INC·Filed 1995·Granted Sep 17, 1996·48 cites·22 claims
- 0571US5656547AMethod for making a leadless surface mounted device with wrap-around flange interface contactsCHIPSCALE INC·Filed 1994·Granted Aug 12, 1997·40 cites·16 claims
- 0669US5904496AWafer fabrication of inside-wrapped contacts for electronic devicesCHIPSCALE INC·Filed 1997·Granted May 18, 1999·31 cites·24 claims
- 0768US6121119AResistor fabricationCHIPSCALE INC·Filed 1997·Granted Sep 19, 2000·38 cites·13 claims
- 0865US6355981B1Wafer fabrication of inside-wrapped contacts for electronic devicesCHIPSCALE INC·Filed 1999·Granted Mar 12, 2002·26 cites·24 claims
- 0964US6833986B2Integrated passive components and package with postsCHIPSCALE INC·Filed 2004·Granted Dec 21, 2004·8 cites·12 claims
- 1057US6946734B2Integrated passive components and package with postsCHIPSCALE INC·Filed 2004·Granted Sep 20, 2005·5 cites·7 claims
- 1151US6414585B1Integrated passive components and package with postsCHIPSCALE INC·Filed 1997·Granted Jul 2, 2002·12 cites·24 claims
- 1245US6954130B2Integrated passive components and package with postsCHIPSCALE INC·Filed 2002·Granted Oct 11, 2005·1 cites·20 claims
- 1344US5592022AFabricating a semiconductor with an insulative coatingCHIPSCALE INC·Filed 1994·Granted Jan 7, 1997·12 cites·29 claims
- 1435US5789817AElectrical apparatus with a metallic layer coupled to a lower region of a substrate and a metallic layer coupled to a lower region of a semiconductor deviceCHIPSCALE INC·Filed 1996·Granted Aug 4, 1998·5 cites·15 claims
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