Assignee
CHO SUNGWON
KR·7 granted patents·2 pending applications·45 citations·filing 2009–2012
Top patents by PatentIndex Score
9 records- 0192US8492197B2Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrateCHO SUNGWON·Filed 2010·Granted Jul 23, 2013·14 cites·31 claims
- 0290US8288203B2Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bumpCHO SUNGWON·Filed 2011·Granted Oct 16, 2012·12 cites·20 claims
- 0385US8574964B2Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tapeCHO SUNGWON·Filed 2010·Granted Nov 5, 2013·7 cites·25 claims
- 0476US8173536B2Semiconductor device and method of forming column interconnect structure to reduce wafer stressCHO SUNGWON·Filed 2009·Granted May 8, 2012·6 cites·27 claims
- 0575US9324659B2Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower dieCHO SUNGWON·Filed 2011·Granted Apr 26, 2016·4 cites·23 claims
- 0664US9093392B2Integrated circuit packaging system with vertical interconnection and method of manufacture thereofCHO SUNGWON·Filed 2010·Granted Jul 28, 2015·2 cites·20 claims
- 0752US2013110602A1Mobile terminal and method of providing social commerce service therein using snsCHO SUNGWON·Filed 2012·Application pending·0 cites
- 0851US8901734B2Semiconductor device and method of forming column interconnect structure to reduce wafer stressCHO SUNGWON·Filed 2012·Granted Dec 2, 2014·0 cites·19 claims
- 0937US2012119345A1Integrated circuit packaging system with device mount and method of manufacture thereofCHO SUNGWON·Filed 2010·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →