Assignee
CHOI HAN NIM
0 granted patents·3 pending applications·0 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0145US2009141472A1Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methodsCHOI HAN NIM·Filed 2008·Application pending·0 cites
- 0240US2009136748A1Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methodsCHOI HAN NIM·Filed 2008·Application pending·0 cites
- 0335US2012029117A1Adhesive film for semiconductor assemblyCHOI HAN NIM·Filed 2011·Application pending·0 cites
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