Assignee
CHOI YEONHO
US·2 granted patents·1 pending application·26 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0187US8067821B1Flat semiconductor package with half package moldingCHOI YEONHO·Filed 2008·Granted Nov 29, 2011·25 cites·14 claims
- 0257US8304866B1Fusion quad flat semiconductor packageCHOI YEONHO·Filed 2011·Granted Nov 6, 2012·1 cites·20 claims
- 0325US2013248305A1Carbon-ceramic brake disk and method for manufacturing sameCHOI YEONHO·Filed 2011·Application pending·0 cites
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