Assignee
CHONG FU CHIUNG
US·1 granted patent·2 pending applications·20 citations·filing 2007–2011
Top patents by PatentIndex Score
3 records- 0182US8575954B2Structures and processes for fabrication of probe card assemblies with multi-layer interconnectCHONG FU CHIUNG·Filed 2008·Granted Nov 5, 2013·20 cites·44 claims
- 0242US2012023730A1Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesCHONG FU CHIUNG·Filed 2011·Application pending·0 cites
- 0336US2012212248A9Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card AssembliesCHONG FU CHIUNG·Filed 2007·Application pending·0 cites
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