Assignee
CHOU CHIEN-KANG
TW·2 granted patents·34 citations·filing 2004–2007
Top patents by PatentIndex Score
2 records- 0190US8836146B2Chip package and method for fabricating the sameCHOU CHIEN-KANG·Filed 2007·Granted Sep 16, 2014·26 cites·48 claims
- 0256US8674507B2Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one waferCHOU CHIEN-KANG·Filed 2004·Granted Mar 18, 2014·8 cites·42 claims
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