Assignee

CHOU CHIU-MING

TW·4 granted patents·32 citations·filing 2005–2009

Technology mixH10W4

Top patents by PatentIndex Score

4 records

0182US8592977B2Integrated circuit (IC) chip and method for fabricating the sameCHOU CHIU-MING·Filed 2007·Granted Nov 26, 2013·11 cites·22 claims
0278US8581404B2Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structuresCHOU CHIU-MING·Filed 2008·Granted Nov 12, 2013·7 cites·23 claims
0378US8242601B2Semiconductor chip with passivation layer comprising metal interconnect and contact padsCHOU CHIU-MING·Filed 2009·Granted Aug 14, 2012·7 cites·33 claims
0475US8198729B2Connection between a semiconductor chip and a circuit component with a large contact areaCHOU CHIU-MING·Filed 2005·Granted Jun 12, 2012·7 cites·29 claims

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