Assignee
CHOW SENG GUAN
SG·30 granted patents·365 citations·filing 2006–2012
Top patents by PatentIndex Score
30 records- 0197US8685792B2Integrated circuit package system with interposerCHOW SENG GUAN·Filed 2008·Granted Apr 1, 2014·52 cites·10 claims
- 0297US8278141B2Integrated circuit package system with internal stacking moduleCHOW SENG GUAN·Filed 2008·Granted Oct 2, 2012·54 cites·19 claims
- 0397US8258015B2Integrated circuit package system with penetrable film adhesiveCHOW SENG GUAN·Filed 2008·Granted Sep 4, 2012·55 cites·24 claims
- 0496US8106500B2Stackable integrated circuit package systemCHOW SENG GUAN·Filed 2010·Granted Jan 31, 2012·28 cites·10 claims
- 0594US9252172B2Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity regionCHOW SENG GUAN·Filed 2011·Granted Feb 2, 2016·34 cites·18 claims
- 0694US8304880B2Integrated circuit packaging system with package-on-package and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Nov 6, 2012·22 cites·20 claims
- 0793US8624364B2Integrated circuit packaging system with encapsulation connector and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Jan 7, 2014·17 cites·20 claims
- 0890US8163600B2Bridge stack integrated circuit package-on-package systemCHOW SENG GUAN·Filed 2006·Granted Apr 24, 2012·20 cites·14 claims
- 0985US8704349B2Integrated circuit package system with exposed interconnectsCHOW SENG GUAN·Filed 2006·Granted Apr 22, 2014·14 cites·8 claims
- 1085US8507319B2Integrated circuit package system with shieldCHOW SENG GUAN·Filed 2007·Granted Aug 13, 2013·13 cites·20 claims
- 1184US8102040B2Integrated circuit package system with die and package combinationCHOW SENG GUAN·Filed 2009·Granted Jan 24, 2012·10 cites·17 claims
- 1279US8138590B2Integrated circuit package system with wire-in-film encapsulationCHOW SENG GUAN·Filed 2008·Granted Mar 20, 2012·8 cites·20 claims
- 1377US8999754B2Integrated circuit package with molded cavityCHOW SENG GUAN·Filed 2012·Granted Apr 7, 2015·3 cites·22 claims
- 1475US9030006B2Integrated circuit package system with internal stacking moduleCHOW SENG GUAN·Filed 2012·Granted May 12, 2015·3 cites·20 claims
- 1573US8422243B2Integrated circuit package system employing a support structure with a recessCHOW SENG GUAN·Filed 2006·Granted Apr 16, 2013·5 cites·10 claims
- 1673US8198735B2Integrated circuit package with molded cavityCHOW SENG GUAN·Filed 2007·Granted Jun 12, 2012·4 cites·12 claims
- 1772US8232658B2Stackable integrated circuit package system with multiple interconnect interfaceCHOW SENG GUAN·Filed 2008·Granted Jul 31, 2012·4 cites·20 claims
- 1867US8604602B2Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Dec 10, 2013·2 cites·20 claims
- 1967US8188586B2Mountable integrated circuit package system with mounting interconnectsCHOW SENG GUAN·Filed 2007·Granted May 29, 2012·3 cites·25 claims
- 2067US8183675B2Integrated circuit package-on-package system with anti-mold flash featureCHOW SENG GUAN·Filed 2007·Granted May 22, 2012·3 cites·20 claims
- 2167US8084849B2Integrated circuit package system with offset stackingCHOW SENG GUAN·Filed 2007·Granted Dec 27, 2011·3 cites·20 claims
- 2264US9171769B2Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor packageCHOW SENG GUAN·Filed 2010·Granted Oct 27, 2015·2 cites·21 claims
- 2364US8143711B2Integrated circuit package system with offset stacking and anti-flash structureCHOW SENG GUAN·Filed 2010·Granted Mar 27, 2012·1 cites·10 claims
- 2463US8124460B2Integrated circuit package system employing an exposed thermally conductive coatingCHOW SENG GUAN·Filed 2006·Granted Feb 28, 2012·2 cites·15 claims
- 2563US8080885B2Integrated circuit packaging system with multi level contact and method of manufacture thereofCHOW SENG GUAN·Filed 2008·Granted Dec 20, 2011·2 cites·20 claims
- 2659US9084377B2Integrated circuit package system with mounting features for clearanceCHOW SENG GUAN·Filed 2007·Granted Jul 14, 2015·1 cites·5 claims
- 2755US8129231B2Method of manufacture for semiconductor package with flow controllerCHOW SENG GUAN·Filed 2009·Granted Mar 6, 2012·0 cites·17 claims
- 2850US8587098B2Integrated circuit protruding pad package system and method for manufacturing thereofCHOW SENG GUAN·Filed 2011·Granted Nov 19, 2013·0 cites·12 claims
- 2947US9293350B2Semiconductor package system with cavity substrate and manufacturing method thereforCHOW SENG GUAN·Filed 2008·Granted Mar 22, 2016·0 cites·20 claims
- 3045US8420950B2Circuit system with leads and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Apr 16, 2013·0 cites·20 claims
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