Assignee
CHUANG YAO-CHUN
TW·5 granted patents·2 pending applications·48 citations·filing 2010–2012
Top patents by PatentIndex Score
7 records- 0195US8299616B2T-shaped post for semiconductor devicesCHUANG YAO-CHUN·Filed 2010·Granted Oct 30, 2012·24 cites·20 claims
- 0292US8232643B2Lead free solder interconnections for integrated circuitsCHUANG YAO-CHUN·Filed 2010·Granted Jul 31, 2012·12 cites·20 claims
- 0386US9257412B2Stress reduction apparatusCHUANG YAO-CHUN·Filed 2012·Granted Feb 9, 2016·6 cites·16 claims
- 0476US8659123B2Metal pad structures in diesCHUANG YAO-CHUN·Filed 2011·Granted Feb 25, 2014·4 cites·20 claims
- 0569US8476759B2Electrical connection structureCHUANG YAO-CHUN·Filed 2011·Granted Jul 2, 2013·2 cites·14 claims
- 0650US2012270369A1Methods for Lead Free Solder Interconnections for Integrated CircuitsCHUANG YAO-CHUN·Filed 2012·Application pending·0 cites
- 0737US2011285013A1Controlling Solder Bump Profiles by Increasing Heights of Solder ResistsCHUANG YAO-CHUN·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →