Assignee

CHUJO SHIGEKI

JP·2 granted patents·5 citations·filing 2010–2010

Technology mixH05K2 H10W2 Y10T2 C23C1 H01L1 H10P1

Top patents by PatentIndex Score

2 records

0176US8196298B2Method for manufacturing electroconductive material-filled throughhole substrateCHUJO SHIGEKI·Filed 2010·Granted Jun 12, 2012·4 cites·7 claims
0266US9136214B2Method for manufacturing multilayer wiring boardCHUJO SHIGEKI·Filed 2010·Granted Sep 15, 2015·1 cites·8 claims

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