Assignee
CHUN JUNG HWAN
KR·4 granted patents·9 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0175US8952514B2Semiconductor packageCHUN JUNG HWAN·Filed 2012·Granted Feb 10, 2015·5 cites·11 claims
- 0266US8222120B2Method of dicing wafer using plasmaCHUN JUNG HWAN·Filed 2009·Granted Jul 17, 2012·4 cites·15 claims
- 0340US8202744B2Wafer through silicon via forming method and equipment thereforCHUN JUNG HWAN·Filed 2009·Granted Jun 19, 2012·0 cites·11 claims
- 0439US9024452B2Semiconductor package comprising an interposer and method of manufacturing the sameCHUN JUNG HWAN·Filed 2012·Granted May 5, 2015·0 cites·9 claims
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