Assignee
CHUNG YU-PENG
TW·2 granted patents·2 pending applications·0 citations·filing 2007–2024
Top patents by PatentIndex Score
4 records- 0146US12057275B2Packaging of roll-type solid electrolytic capacitor elementsCHUNG YU PENG·Filed 2022·Granted Aug 6, 2024·0 cites·10 claims
- 0243US2024304394A1Packaging of Roll-type Electrolytic Capacitor ElementsCHUNG YU PENG·Filed 2024·Application pending·0 cites
- 0338US12057274B2Packaging structures for electronic elements and solid electrolytic capacitor elements and methods thereofCHUNG YU PENG·Filed 2022·Granted Aug 6, 2024·0 cites·14 claims
- 0430US2007241439A1RFID package structureCHUNG YU-PENG·Filed 2007·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →