Assignee
CO REYNALDO
US·3 granted patents·14 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0181US8680687B2Electrical interconnect for die stacked in zig-zag configurationCO REYNALDO·Filed 2010·Granted Mar 25, 2014·7 cites·31 claims
- 0276US9153517B2Electrical connector between die pad and z-interconnect for stacked die assembliesCO REYNALDO·Filed 2011·Granted Oct 6, 2015·5 cites·19 claims
- 0368US8884403B2Semiconductor die array structureCO REYNALDO·Filed 2010·Granted Nov 11, 2014·2 cites·8 claims
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