Assignee
COLGAN EVAN G
US·9 granted patents·40 citations·filing 2010–2012
Top patents by PatentIndex Score
9 records- 0196US8693200B2Semiconductor device cooling moduleCOLGAN EVAN G·Filed 2012·Granted Apr 8, 2014·31 cites·17 claims
- 0276US8954712B2Computer system including an all-to-all communication network of processors connected using electrical and optical linksCOLGAN EVAN G·Filed 2011·Granted Feb 10, 2015·3 cites·18 claims
- 0374US8330262B2Processes for enhanced 3D integration and structures generated using the sameCOLGAN EVAN G·Filed 2010·Granted Dec 11, 2012·2 cites·6 claims
- 0463US8823164B2Heatsink attachment moduleCOLGAN EVAN G·Filed 2011·Granted Sep 2, 2014·1 cites·18 claims
- 0562US8569874B2High memory density, high input/output bandwidth logic-memory structure and architectureCOLGAN EVAN G·Filed 2011·Granted Oct 29, 2013·3 cites·19 claims
- 0656US8600202B2Process for enhanced 3D integration and structures generated using the sameCOLGAN EVAN G·Filed 2012·Granted Dec 3, 2013·0 cites·2 claims
- 0756US8476753B2Process for enhanced 3D integration and structures generated using the sameCOLGAN EVAN G·Filed 2012·Granted Jul 2, 2013·0 cites·6 claims
- 0847US8268389B2Precast thermal interface adhesive for easy and repeated, separation and rematingCOLGAN EVAN G·Filed 2010·Granted Sep 18, 2012·0 cites·11 claims
- 0943US9093445B2Packaging identical chips in a stacked structureCOLGAN EVAN G·Filed 2011·Granted Jul 28, 2015·0 cites·20 claims
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