Assignee
COMCHIP TECH CO LTD
TW·7 granted patents·0 citations·filing 2019–2020
Top patents by PatentIndex Score
7 records- 0150US11264355B2Method of manufacturing die package structureCOMCHIP TECH CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 0249US11302664B2Method of manufacturing die package structureCOMCHIP TECH CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·10 claims
- 0348US10910268B2Method of manufacturing a chip packageCOMCHIP TECH CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·10 claims
- 0447US10777461B2Method for manufacturing a chip packageCOMCHIP TECH CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·4 claims
- 0547US10665509B2Method for manufacturing chip packagesCOMCHIP TECH CO LTD·Filed 2019·Granted May 26, 2020·0 cites·9 claims
- 0646US10937760B2Method for manufacturing a chip packageCOMCHIP TECH CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·9 claims
- 0741US10950502B2Method of manufacturing a chip packageCOMCHIP TECH CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·11 claims
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