Assignee
COMPASS TECH COMPANY LIMITED
HK·15 granted patents·3 pending applications·15 citations·filing 2016–2022
Top patents by PatentIndex Score
18 records- 0188US11076491B2Integrated electro-optical flexible circuit boardCOMPASS TECH COMPANY LIMITED·Filed 2019·Granted Jul 27, 2021·5 cites·22 claims
- 0288US10917973B1Method of direct embedding a lithium ion battery on a flexible printed circuit boardCOMPASS TECH COMPANY LIMITED·Filed 2020·Granted Feb 9, 2021·3 cites·13 claims
- 0384US10103095B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2016·Granted Oct 16, 2018·4 cites·11 claims
- 0476US10643942B2Formation of fine pitch traces using ultra-thin PAA modified fully additive processCOMPASS TECH COMPANY LIMITED·Filed 2019·Granted May 5, 2020·0 cites·25 claims
- 0570US10923449B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2018·Granted Feb 16, 2021·1 cites·20 claims
- 0670US10510653B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2018·Granted Dec 17, 2019·1 cites·9 claims
- 0770US10468342B2Formation of fine pitch traces using ultra-thin PAA modified fully additive processCOMPASS TECH COMPANY LIMITED·Filed 2018·Granted Nov 5, 2019·1 cites·22 claims
- 0867US11749595B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 0967US11553598B2Integrated electro-optical flexible circuit boardCOMPASS TECH COMPANY LIMITED·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1065US11594509B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 1164US12249704B2Method of direct embedding a lithium ion battery on a flexible printed circuit boardCOMPASS TECH COMPANY LIMITED·Filed 2021·Granted Mar 11, 2025·0 cites·14 claims
- 1263US10636734B2Formation of fine pitch traces using ultra-thin PAA modified fully additive processCOMPASS TECH COMPANY LIMITED·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 1359US11069606B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2019·Granted Jul 20, 2021·0 cites·18 claims
- 1459US10362680B2Patterning of graphene circuits on flexible substratesCOMPASS TECH COMPANY LIMITED·Filed 2018·Granted Jul 23, 2019·0 cites·20 claims
- 1555US9974188B2Patterning of graphene circuits on flexible substratesCOMPASS TECH COMPANY LIMITED·Filed 2016·Granted May 15, 2018·0 cites·24 claims
- 1652US2023122858A1Method of Embedding a Multi-Layer Lithium Ion Battery on a Flexible Printed Circuit BoardCOMPASS TECH COMPANY LIMITED·Filed 2021·Application pending·0 cites
- 1752US2024178124A1Embedded Die PackageCOMPASS TECH COMPANY LIMITED·Filed 2022·Application pending·0 cites
- 1845US2022181165A1Fabrication Method of Flexible Cyclo-Olefin Polymer (COP) Substrate for IC Packaging of Communication Devices and Biocompatible Sensors DevicesCOMPASS TECH COMPANY LIMITED·Filed 2020·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →