Assignee
COMPASS TECHNOLOGY CO LTD
HK·3 granted patents·14 citations·filing 2006–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0178US7906844B2Multiple integrated circuit die package with thermal performanceCOMPASS TECHNOLOGY CO LTD·Filed 2006·Granted Mar 15, 2011·8 cites·16 claims
- 0264US7573131B2Die-up integrated circuit package with grounded stiffenerCOMPASS TECHNOLOGY CO LTD·Filed 2006·Granted Aug 11, 2009·5 cites·26 claims
- 0360US8361837B2Multiple integrated circuit die package with thermal performanceCOMPASS TECHNOLOGY CO LTD·Filed 2011·Granted Jan 29, 2013·1 cites·32 claims
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