Assignee
COMPONENT RE ENG COMPANY INC
US·10 granted patents·3 pending applications·7 citations·filing 2013–2018
Top patents by PatentIndex Score
13 records- 0174US10646941B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 12, 2020·1 cites·16 claims
- 0271US10471531B2High temperature resistant silicon joint for the joining of ceramicsCOMPONENT RE ENG COMPANY INC·Filed 2015·Granted Nov 12, 2019·1 cites·11 claims
- 0371US10384283B2Method for making a high temperature resistant silicon alloy joint for the joining of ceramics and devices using sameCOMPONENT RE ENG COMPANY INC·Filed 2015·Granted Aug 20, 2019·1 cites·1 claims
- 0470US9984866B2Multiple zone heaterCOMPONENT RE ENG COMPANY INC·Filed 2013·Granted May 29, 2018·2 cites·7 claims
- 0569US10593584B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Mar 17, 2020·1 cites·27 claims
- 0667US10153183B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2014·Granted Dec 11, 2018·1 cites·10 claims
- 0761US10991616B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2018·Granted Apr 27, 2021·0 cites·7 claims
- 0857US10213858B2Multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Feb 26, 2019·0 cites·15 claims
- 0955US10287215B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 14, 2019·0 cites·14 claims
- 1052US2019066980A1Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Semiconductor Processing ApplicationsCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 1148US9999947B2Method for repairing heaters and chucks used in semiconductor processingCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Jun 19, 2018·0 cites·22 claims
- 1248US2019366459A1Method for repairing heaters and chucks used in semiconductor processingCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 1347US2018354861A1Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Industrial ApplicationsCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when COMPONENT RE ENG COMPANY INC files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →