Assignee
COVALENT MATERIALS CORP
JP·20 granted patents·19 pending applications·663 citations·filing 2003–2014
Top patents by PatentIndex Score
39 records- 0193US7374955B2Method of manufacturing silicon waferCOVALENT MATERIALS CORP·Filed 2006·Granted May 20, 2008·25 cites·6 claims
- 0292US7393418B2SusceptorCOVALENT MATERIALS CORP·Filed 2005·Granted Jul 1, 2008·542 cites·5 claims
- 0391US9117743B2Nitride semiconductor substrateCOVALENT MATERIALS CORP·Filed 2014·Granted Aug 25, 2015·10 cites·4 claims
- 0491US7608553B2Transparent rare-earth oxide sintered body and manufacturing method thereofCOVALENT MATERIALS CORP·Filed 2006·Granted Oct 27, 2009·17 cites·12 claims
- 0582US7485593B2Titania-silica glassCOVALENT MATERIALS CORP·Filed 2007·Granted Feb 3, 2009·14 cites·9 claims
- 0682US7368757B2Compound semiconductor and compound semiconductor device using the sameCOVALENT MATERIALS CORP·Filed 2005·Granted May 6, 2008·8 cites·5 claims
- 0779US9139448B2Heat-insulating materialCOVALENT MATERIALS CORP·Filed 2013·Granted Sep 22, 2015·3 cites·14 claims
- 0877US7396409B2Acicular silicon crystal and process for producing the sameCOVALENT MATERIALS CORP·Filed 2003·Granted Jul 8, 2008·26 cites·3 claims
- 0974US7909931B2Silica glass crucibleCOVALENT MATERIALS CORP·Filed 2007·Granted Mar 22, 2011·4 cites·7 claims
- 1069US7977219B2Manufacturing method for silicon waferCOVALENT MATERIALS CORP·Filed 2009·Granted Jul 12, 2011·3 cites·5 claims
- 1165US7476634B2Yttria sintered body and manufacturing method thereforCOVALENT MATERIALS CORP·Filed 2006·Granted Jan 13, 2009·2 cites·4 claims
- 1264US7381362B2Production method for ceramic porous materialCOVALENT MATERIALS CORP·Filed 2005·Granted Jun 3, 2008·1 cites·14 claims
- 1362US7262485B2Substrate for growing electro-optical single crystal thin film and method of manufacturing the sameCOVALENT MATERIALS CORP·Filed 2005·Granted Aug 28, 2007·1 cites·7 claims
- 1461US8637960B2Nitride semiconductor substrateCOVALENT MATERIALS CORP·Filed 2012·Granted Jan 28, 2014·1 cites·2 claims
- 1561US7291220B2Process of producing silicon waferCOVALENT MATERIALS CORP·Filed 2005·Granted Nov 6, 2007·1 cites·3 claims
- 1658US7588638B2Single crystal pulling apparatusCOVALENT MATERIALS CORP·Filed 2008·Granted Sep 15, 2009·3 cites·4 claims
- 1757US2008271490A1Channel structure and process for production thereofCOVALENT MATERIALS CORP·Filed 2008·Application pending·0 cites
- 1855US2009261299A1Silicon waferCOVALENT MATERIALS CORP·Filed 2009·Application pending·0 cites
- 1951US2010178694A1Cell culture moduleCOVALENT MATERIALS CORP·Filed 2008·Application pending·0 cites
- 2049US2010216262A1Method for producing bonded waferCOVALENT MATERIALS CORP·Filed 2009·Application pending·0 cites
- 2148US2009065812A1Compound semiconductor substrateCOVALENT MATERIALS CORP·Filed 2008·Application pending·0 cites
- 2248US2010101485A1Manufacturing method of silicon single crystalCOVALENT MATERIALS CORP·Filed 2009·Application pending·0 cites
- 2347US9086321B2Method of analyzing nitride semiconductor layer and method of manufacturing nitride semiconductor substrate using the analysis methodCOVALENT MATERIALS CORP·Filed 2013·Granted Jul 21, 2015·0 cites·4 claims
- 2447US7514364B2Hydrophilicity treatment method of a silicon waferCOVALENT MATERIALS CORP·Filed 2007·Granted Apr 7, 2009·0 cites·1 claims
- 2547US2008224268A1Nitride semiconductor single crystal substrateCOVALENT MATERIALS CORP·Filed 2008·Application pending·0 cites
- 2647US2010069227A1Ceramics for plasma treatment apparatusCOVALENT MATERIALS CORP·Filed 2009·Application pending·0 cites
- 2746US2009277377A1Crucible for melting silicon and release agent used to the sameCOVALENT MATERIALS CORP·Filed 2009·Application pending·0 cites
- 2846US2008078501A1Method of joining a porous silicon carbide body and a silicon carbide-silicon compositeCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 2945US2009226699A1Sintered body and member used for plasma processing apparatusCOVALENT MATERIALS CORP·Filed 2009·Application pending·0 cites
- 3045US2009038537A1Method of pulling up silicon single crystalCOVALENT MATERIALS CORP·Filed 2008·Application pending·0 cites
- 3145US2008237190A1Surface cleaning method of semiconductor wafer heat treatment boatCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 3244US2008164572A1Semiconductor substrate and manufacturing method thereofCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 3344US2009004825A1Method of manufacturing semiconductor substrateCOVALENT MATERIALS CORP·Filed 2008·Application pending·0 cites
- 3444US2010021734A1Ceramic particles and producing method thereofCOVALENT MATERIALS CORP·Filed 2009·Application pending·0 cites
- 3543US2013224479A1Carbon-fiber-reinforced silicon-carbide-based composite material and braking materialCOVALENT MATERIALS CORP·Filed 2013·Application pending·0 cites
- 3641US2008166891A1Heat treatment method for silicon waferCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 3741US2011214603A1Method of manufacturing silicon single crystalCOVALENT MATERIALS CORP·Filed 2011·Application pending·0 cites
- 3837US7699612B2Method for fixing an implant, fixing member for the implant and implant compositeCOVALENT MATERIALS CORP·Filed 2004·Granted Apr 20, 2010·2 cites·6 claims
- 3937US7336892B2Reflection plate for semiconductor heat treatment and manufacturing method thereofCOVALENT MATERIALS CORP·Filed 2003·Granted Feb 26, 2008·0 cites·18 claims
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