Assignee
CRISP RICHARD DEWITT
US·19 granted patents·671 citations·filing 2011–2012
Top patents by PatentIndex Score
19 records- 0199US8405207B1Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Mar 26, 2013·42 cites·30 claims
- 0298US8659141B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·37 cites·30 claims
- 0398US8659142B2Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·31 cites·30 claims
- 0498US8659143B2Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·32 cites·30 claims
- 0598US8653646B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 18, 2014·31 cites·30 claims
- 0698US8513813B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Aug 20, 2013·39 cites·30 claims
- 0798US8502390B2De-skewed multi-die packagesCRISP RICHARD DEWITT·Filed 2011·Granted Aug 6, 2013·42 cites·36 claims
- 0898US8441111B2Stub minimization for multi-die wirebond assemblies with parallel windowsCRISP RICHARD DEWITT·Filed 2012·Granted May 14, 2013·49 cites·30 claims
- 0998US8436457B2Stub minimization for multi-die wirebond assemblies with parallel windowsCRISP RICHARD DEWITT·Filed 2011·Granted May 7, 2013·45 cites·30 claims
- 1098US8436477B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted May 7, 2013·48 cites·30 claims
- 1198US8254155B1Stub minimization for multi-die wirebond assemblies with orthogonal windowsCRISP RICHARD DEWITT·Filed 2012·Granted Aug 28, 2012·68 cites·30 claims
- 1297US8659139B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·32 cites·30 claims
- 1397US8659140B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·31 cites·30 claims
- 1497US8629545B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Jan 14, 2014·32 cites·28 claims
- 1597US8610260B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Dec 17, 2013·35 cites·31 claims
- 1697US8525327B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Sep 3, 2013·33 cites·30 claims
- 1797US8278764B1Stub minimization for multi-die wirebond assemblies with orthogonal windowsCRISP RICHARD DEWITT·Filed 2012·Granted Oct 2, 2012·36 cites·30 claims
- 1876US9123713B2Lead structures with vertical offsetsCRISP RICHARD DEWITT·Filed 2011·Granted Sep 1, 2015·4 cites·29 claims
- 1976US8692611B2Power boosting circuit for semiconductor packagingCRISP RICHARD DEWITT·Filed 2011·Granted Apr 8, 2014·4 cites·15 claims
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