Assignee
DAIWA FINE CHEMICALS CO LTD
JP·8 granted patents·3 pending applications·365 citations·filing 1995–2013
Top patents by PatentIndex Score
11 records- 0196US6607653B1Plating bath and process for depositing alloy containing tin and copperDAIWA FINE CHEMICALS CO LTD·Filed 2000·Granted Aug 19, 2003·86 cites·15 claims
- 0294US6183545B1Aqueous solutions for obtaining metals by reductive depositionDAIWA FINE CHEMICALS CO LTD·Filed 1999·Granted Feb 6, 2001·142 cites·12 claims
- 0382US6338787B1Redox system electroless plating methodDAIWA FINE CHEMICALS CO LTD·Filed 2000·Granted Jan 15, 2002·25 cites·13 claims
- 0477US6235093B1Aqueous solutions for obtaining noble metals by chemical reductive depositionDAIWA FINE CHEMICALS CO LTD·Filed 1999·Granted May 22, 2001·47 cites·4 claims
- 0576US6852210B2Plating method and plating bath precursor used thereforDAIWA FINE CHEMICALS CO LTD·Filed 2002·Granted Feb 8, 2005·17 cites·3 claims
- 0673US5618404AElectrolytic process for producing lead sulfonate and tin sulfonate for solder plating useDAIWA FINE CHEMICALS CO LTD·Filed 1995·Granted Apr 8, 1997·29 cites·3 claims
- 0771US7166152B2Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the methodDAIWA FINE CHEMICALS CO LTD·Filed 2003·Granted Jan 23, 2007·13 cites·27 claims
- 0860US7056448B2Method for forming circuit patternDAIWA FINE CHEMICALS CO LTD·Filed 2003·Granted Jun 6, 2006·6 cites·17 claims
- 0951US2009159453A1Method for silver platingDAIWA FINE CHEMICALS CO LTD·Filed 2008·Application pending·0 cites
- 1037US2015184307A1Silver electroplating solutionDAIWA FINE CHEMICALS CO LTD·Filed 2013·Application pending·0 cites
- 1137US2003150743A1Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bathDAIWA FINE CHEMICALS CO LTD·Filed 2002·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →