Assignee
DARVEAUX ROBERT FRANCIS
US·6 granted patents·147 citations·filing 2009–2011
Top patents by PatentIndex Score
6 records- 0196US8653674B1Electronic component package fabrication method and structureDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Feb 18, 2014·28 cites·20 claims
- 0296US8482134B1Stackable package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Jul 9, 2013·30 cites·4 claims
- 0394US8536462B1Flex circuit package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Sep 17, 2013·41 cites·20 claims
- 0494US8536458B1Fine pitch copper pillar package and methodDARVEAUX ROBERT FRANCIS·Filed 2009·Granted Sep 17, 2013·27 cites·18 claims
- 0593US8300423B1Stackable treated via package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Oct 30, 2012·18 cites·19 claims
- 0679US8207022B1Exposed die overmolded flip chip package methodDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Jun 26, 2012·3 cites·20 claims
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