Individual holder
DAUBENSPECK TIMOTHY H
US·34 granted patents·3 pending applications·146 citations·filing 2006–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
37 records- 0196US8742594B2Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstopDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jun 3, 2014·30 cites·15 claims
- 0296US8508043B2Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bumpDAUBENSPECK TIMOTHY H·Filed 2011·Granted Aug 13, 2013·24 cites·19 claims
- 0388US8476762B2Ni plating of a BLM edge for Pb-free C4 undercut controlDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jul 2, 2013·8 cites·16 claims
- 0488US8198133B2Structures and methods to improve lead-free C4 interconnect reliabilityDAUBENSPECK TIMOTHY H·Filed 2009·Granted Jun 12, 2012·16 cites·12 claims
- 0584US8138099B1Chip package solder interconnect formed by surface tensionDAUBENSPECK TIMOTHY H·Filed 2010·Granted Mar 20, 2012·7 cites·20 claims
- 0683US8492892B2Solder bump connectionsDAUBENSPECK TIMOTHY H·Filed 2010·Granted Jul 23, 2013·6 cites·19 claims
- 0783US8159067B2Underfill flow guide structuresDAUBENSPECK TIMOTHY H·Filed 2008·Granted Apr 17, 2012·8 cites·11 claims
- 0882US8212357B2Combination via and pad structure for improved solder bump electromigration characteristicsDAUBENSPECK TIMOTHY H·Filed 2008·Granted Jul 3, 2012·10 cites·22 claims
- 0978US8084858B2Metal wiring structures for uniform current density in C4 ballsDAUBENSPECK TIMOTHY H·Filed 2009·Granted Dec 27, 2011·6 cites·10 claims
- 1076US8426247B2Polymer and solder pillars for connecting chip and carrierDAUBENSPECK TIMOTHY H·Filed 2012·Granted Apr 23, 2013·3 cites·19 claims
- 1176US8298929B2Offset solder vias, methods of manufacturing and design structuresDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·4 cites·6 claims
- 1276US8237279B2Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrateDAUBENSPECK TIMOTHY H·Filed 2010·Granted Aug 7, 2012·4 cites·20 claims
- 1375US8242012B2Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structureDAUBENSPECK TIMOTHY H·Filed 2010·Granted Aug 14, 2012·4 cites·9 claims
- 1473US8916463B2Wire bond splash containmentDAUBENSPECK TIMOTHY H·Filed 2012·Granted Dec 23, 2014·3 cites·25 claims
- 1573US8710656B2Redistribution layer (RDL) with variable offset bumpsDAUBENSPECK TIMOTHY H·Filed 2012·Granted Apr 29, 2014·3 cites·19 claims
- 1672US8513814B2Buffer pad in solder bump connections and methods of manufactureDAUBENSPECK TIMOTHY H·Filed 2011·Granted Aug 20, 2013·3 cites·11 claims
- 1769US8680675B2Structures and methods for improving solder bump connections in semiconductor devicesDAUBENSPECK TIMOTHY H·Filed 2010·Granted Mar 25, 2014·2 cites·21 claims
- 1869US8299581B2Passivation layer extension to chip edgeDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·3 cites·18 claims
- 1964US9040390B2Releasable buried layer for 3-D fabrication and methods of manufacturingDAUBENSPECK TIMOTHY H·Filed 2012·Granted May 26, 2015·1 cites·18 claims
- 2060US8916464B2Structures and methods for improving solder bump connections in semiconductor devicesDAUBENSPECK TIMOTHY H·Filed 2008·Granted Dec 23, 2014·1 cites·20 claims
- 2156US8164188B2Methods of forming solder connections and structure thereofDAUBENSPECK TIMOTHY H·Filed 2009·Granted Apr 24, 2012·0 cites·19 claims
- 2255US8766439B2Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chipDAUBENSPECK TIMOTHY H·Filed 2009·Granted Jul 1, 2014·0 cites·25 claims
- 2353US8927869B2Semiconductor structures and methods of manufactureDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jan 6, 2015·0 cites·8 claims
- 2453US8409980B2Underfill flow guide structures and method of using sameDAUBENSPECK TIMOTHY H·Filed 2012·Granted Apr 2, 2013·0 cites·15 claims
- 2553US8338947B2Solder interconnect pads with current spreading layersDAUBENSPECK TIMOTHY H·Filed 2012·Granted Dec 25, 2012·0 cites·8 claims
- 2653US8114767B2Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereofDAUBENSPECK TIMOTHY H·Filed 2008·Granted Feb 14, 2012·0 cites·8 claims
- 2752US9607862B2Extrusion-resistant solder interconnect structures and methods of formingDAUBENSPECK TIMOTHY H·Filed 2012·Granted Mar 28, 2017·0 cites·18 claims
- 2852US8264078B2Metal wiring structures for uniform current density in C4 ballsDAUBENSPECK TIMOTHY H·Filed 2011·Granted Sep 11, 2012·0 cites·10 claims
- 2951US2009200663A1Polymer and solder pillars for connecting chip and carrierDAUBENSPECK TIMOTHY H·Filed 2008·Application pending·0 cites
- 3050US8299568B2Damage propagation barrierDAUBENSPECK TIMOTHY H·Filed 2011·Granted Oct 30, 2012·0 cites·11 claims
- 3149US9000585B2Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereofDAUBENSPECK TIMOTHY H·Filed 2012·Granted Apr 7, 2015·0 cites·15 claims
- 3247US8809182B2Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joiningDAUBENSPECK TIMOTHY H·Filed 2008·Granted Aug 19, 2014·0 cites·20 claims
- 3347US8227333B2Ni plating of a BLM edge for Pb-free C4 undercut controlDAUBENSPECK TIMOTHY H·Filed 2010·Granted Jul 24, 2012·0 cites·5 claims
- 3446US8546253B1Self-aligned polymer passivation/aluminum padDAUBENSPECK TIMOTHY H·Filed 2012·Granted Oct 1, 2013·0 cites·20 claims
- 3544US8629557B2Structures and methods for detecting solder wetting of pedestal sidewallsDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jan 14, 2014·0 cites·21 claims
- 3644US2007212872A1Single mask process for variable thickness dual damascene structures, other grey-masking processes, and structures made using grey-maskingDAUBENSPECK TIMOTHY H·Filed 2007·Application pending·0 cites
- 3743US2007287279A1Methods of forming solder connections and structure thereofDAUBENSPECK TIMOTHY H·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →