Assignee
DAWNING LEADING TECH INC
TW·6 granted patents·7 citations·filing 2014–2015
Top patents by PatentIndex Score
6 records- 0179US9412722B1Multichip stacking package structure and method for manufacturing the sameDAWNING LEADING TECH INC·Filed 2015·Granted Aug 9, 2016·4 cites·9 claims
- 0265US9892988B2Semiconductor packaging structure and manufacturing method for the sameDAWNING LEADING TECH INC·Filed 2014·Granted Feb 13, 2018·2 cites·15 claims
- 0361US9478512B2Semiconductor packaging structure having stacked seed layersDAWNING LEADING TECH INC·Filed 2015·Granted Oct 25, 2016·1 cites·9 claims
- 0445US9646937B2Packaging structure for thin die and method for manufacturing the sameDAWNING LEADING TECH INC·Filed 2014·Granted May 9, 2017·0 cites·6 claims
- 0543US9607933B2Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structureDAWNING LEADING TECH INC·Filed 2014·Granted Mar 28, 2017·0 cites·5 claims
- 0635US9887145B2Metal top stacking package structure and method for manufacturing the sameDAWNING LEADING TECH INC·Filed 2015·Granted Feb 6, 2018·0 cites·13 claims
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