Assignee
DI CIOCCIO LEA
FR·4 granted patents·2 pending applications·28 citations·filing 2003–2011
Top patents by PatentIndex Score
6 records- 0189US9027821B2Process for direct bonding two elements comprising copper portions and portions of dielectric materialsDI CIOCCIO LEA·Filed 2011·Granted May 12, 2015·15 cites·18 claims
- 0287US8647983B2Simplified copper-copper bondingDI CIOCCIO LEA·Filed 2010·Granted Feb 11, 2014·12 cites·15 claims
- 0360US9620412B2Method for modifying the crystalline structure of a copper elementDI CIOCCIO LEA·Filed 2010·Granted Apr 11, 2017·1 cites·11 claims
- 0442US8642391B2Self-assembly of chips on a substrateDI CIOCCIO LEA·Filed 2009·Granted Feb 4, 2014·0 cites·23 claims
- 0539US2008311725A1Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding LayerDI CIOCCIO LEA·Filed 2006·Application pending·0 cites
- 0637US2006125057A1Method for the production of a composite sicoi-type substrate comprising an epitaxy stageDI CIOCCIO LEA·Filed 2003·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →