Assignee
DIDREW TECH BVI LIMITED
US·8 granted patents·2 pending applications·33 citations·filing 2018–2021
Top patents by PatentIndex Score
10 records- 0193US10347509B1Molded cavity fanout package without using a carrier and method of manufacturing the sameDIDREW TECH BVI LIMITED·Filed 2018·Granted Jul 9, 2019·12 cites·14 claims
- 0293US10209542B1System and method of embedding driver IC (EmDIC) in LCD display substrateDIDREW TECH BVI LIMITED·Filed 2018·Granted Feb 19, 2019·7 cites·20 claims
- 0390US12199025B2Interposer structure containing embedded silicon-less link chipletDIDREW TECH BVI LIMITED·Filed 2021·Granted Jan 14, 2025·2 cites·15 claims
- 0489US10424524B2Multiple wafers fabrication technique on large carrier with warpage control stiffenerDIDREW TECH BVI LIMITED·Filed 2018·Granted Sep 24, 2019·6 cites·20 claims
- 0581US10209597B1System and method of manufacturing frameless LCD displayDIDREW TECH BVI LIMITED·Filed 2018·Granted Feb 19, 2019·5 cites·20 claims
- 0670US10211077B2Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solventDIDREW TECH BVI LIMITED·Filed 2018·Granted Feb 19, 2019·1 cites·20 claims
- 0746US10913254B2Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using chemical and mechanical meansDIDREW TECH BVI LIMITED·Filed 2018·Granted Feb 9, 2021·0 cites·20 claims
- 0845US2021287953A1Embedded molding fan-out (emfo) packaging and method of manufacturing thereofDIDREW TECH BVI LIMITED·Filed 2020·Application pending·0 cites
- 0939US10734326B2Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (EMI) shield package and method of manufacturing thereof for reducing warpageDIDREW TECH BVI LIMITED·Filed 2018·Granted Aug 4, 2020·0 cites·17 claims
- 1039US2019259675A1Glass frame fan out packaging and method of manufacturing thereofDIDREW TECH BVI LIMITED·Filed 2018·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →