Assignee
DIJKSTRA PAUL
NL·2 granted patents·42 citations·filing 2006–2006
Top patents by PatentIndex Score
2 records- 0192US8183682B2Methods of packaging a semiconductor die and package formed by the methodsDIJKSTRA PAUL·Filed 2006·Granted May 22, 2012·36 cites·25 claims
- 0268US8159826B2Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatmentsDIJKSTRA PAUL·Filed 2006·Granted Apr 17, 2012·6 cites·16 claims
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