Assignee

DING HAI

US·3 granted patents·1 citations·filing 2008–2024

Technology mixH01L1 H10B1 H10W1 Y02E1

Top patents by PatentIndex Score

3 records

0152US9059174B2Method to reduce metal fuse thickness without extra maskDING HAI·Filed 2008·Granted Jun 16, 2015·1 cites·6 claims
0242USD1105549SLampDING HAI·Filed 2024·Granted Dec 9, 2025·0 cites·1 claims
0341USD1109903SLampDING HAI·Filed 2024·Granted Jan 20, 2026·0 cites·1 claims

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