Assignee
DING HANYI
US·38 granted patents·388 citations·filing 2007–2012
Top patents by PatentIndex Score
38 records- 0199US8519892B2Integrated millimeter wave antenna and transceiver on a substrateDING HANYI·Filed 2012·Granted Aug 27, 2013·197 cites·19 claims
- 0293US8592876B2Micro-electro-mechanical system (MEMS) capacitive OHMIC switch and design structuresDING HANYI·Filed 2012·Granted Nov 26, 2013·9 cites·9 claims
- 0392US8415999B2High frequency quadrature PLL circuit and methodDING HANYI·Filed 2010·Granted Apr 9, 2013·12 cites·24 claims
- 0492US8193878B2Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedanceDING HANYI·Filed 2008·Granted Jun 5, 2012·16 cites·16 claims
- 0589US8518787B2Through wafer vias and method of making sameDING HANYI·Filed 2012·Granted Aug 27, 2013·9 cites·20 claims
- 0689US8514028B2Load tolerant voltage controlled oscillator (VCO), IC and CMOS IC including the VCODING HANYI·Filed 2011·Granted Aug 20, 2013·9 cites·20 claims
- 0786US8421183B2Structure of very high insertion loss of the substrate noise decouplingDING HANYI·Filed 2011·Granted Apr 16, 2013·6 cites·14 claims
- 0886US8232920B2Integrated millimeter wave antenna and transceiver on a substrateDING HANYI·Filed 2008·Granted Jul 31, 2012·15 cites·17 claims
- 0986US8232115B2Test structure for determination of TSV depthDING HANYI·Filed 2009·Granted Jul 31, 2012·11 cites·11 claims
- 1085US8994393B2High-frequency cobra probeDING HANYI·Filed 2012·Granted Mar 31, 2015·11 cites·13 claims
- 1185US8188808B2Compact on-chip branchline coupler using slow wave transmission lineDING HANYI·Filed 2009·Granted May 29, 2012·12 cites·19 claims
- 1284US8138857B2Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedanceDING HANYI·Filed 2008·Granted Mar 20, 2012·10 cites·24 claims
- 1382US8508314B2On-chip variable delay transmission line with fixed characteristic impedanceDING HANYI·Filed 2012·Granted Aug 13, 2013·4 cites·16 claims
- 1482US8399927B2Semiconductor structure including a high performance fet and a high voltage fet on an SOI substrateDING HANYI·Filed 2012·Granted Mar 19, 2013·5 cites·12 claims
- 1581US8138876B2On-chip integrated voltage-controlled variable inductor, methods of making and tuning such variable inductors, and design structures integrating such variable inductorsDING HANYI·Filed 2008·Granted Mar 20, 2012·11 cites·26 claims
- 1680US8791771B2Reconfigurable Wilkinson power divider and design structure thereofDING HANYI·Filed 2011·Granted Jul 29, 2014·4 cites·21 claims
- 1780US8476988B2Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedanceDING HANYI·Filed 2012·Granted Jul 2, 2013·4 cites·12 claims
- 1877US8279572B2Structure for an on-chip high frequency electro-static discharge deviceDING HANYI·Filed 2008·Granted Oct 2, 2012·7 cites·10 claims
- 1977US8106728B2Circuit structure and design structure for an optionally switchable on-chip slow wave transmission line band-stop filter and a method of manufactureDING HANYI·Filed 2009·Granted Jan 31, 2012·9 cites·18 claims
- 2076US8898605B2On-chip tunable transmission lines, methods of manufacture and design structuresDING HANYI·Filed 2010·Granted Nov 25, 2014·4 cites·18 claims
- 2175US8853693B2Test structure for determination of TSV depthDING HANYI·Filed 2012·Granted Oct 7, 2014·3 cites·13 claims
- 2275US8645898B2Structure and design structure for high-Q value inductor and method of manufacturing the sameDING HANYI·Filed 2012·Granted Feb 4, 2014·3 cites·20 claims
- 2375US8299566B2Through wafer vias and method of making sameDING HANYI·Filed 2008·Granted Oct 30, 2012·5 cites·11 claims
- 2475US8232173B2Structure and design structure for high-Q value inductor and method of manufacturing the sameDING HANYI·Filed 2010·Granted Jul 31, 2012·3 cites·10 claims
- 2570US8413098B2T-connections, methodology for designing T-connections, and compact modeling of T-connectionsDING HANYI·Filed 2009·Granted Apr 2, 2013·4 cites·25 claims
- 2668US8900964B2Inductors and wiring structures fabricated with limited wiring materialDING HANYI·Filed 2012·Granted Dec 2, 2014·2 cites·12 claims
- 2766US8436446B2Method, structure, and design structure for a through-silicon-via Wilkinson power dividerDING HANYI·Filed 2012·Granted May 7, 2013·1 cites·9 claims
- 2864US8446014B2Integrated circuit interconnect structureDING HANYI·Filed 2012·Granted May 21, 2013·1 cites·6 claims
- 2961US8860191B2On-chip transmission line structures with balanced phase delayDING HANYI·Filed 2011·Granted Oct 14, 2014·1 cites·18 claims
- 3056US8216912B2Method, structure, and design structure for a through-silicon-via Wilkinson power dividerDING HANYI·Filed 2009·Granted Jul 10, 2012·0 cites·20 claims
- 3153US8455351B2Method of forming an integrated circuit interconnect structureDING HANYI·Filed 2012·Granted Jun 4, 2013·0 cites·6 claims
- 3251US8120110B2Semiconductor structure including a high performance FET and a high voltage FET on a SOI substrateDING HANYI·Filed 2008·Granted Feb 21, 2012·0 cites·12 claims
- 3350US8589832B2On chip shielding structure for integrated circuits or devices on a substrate and method of shieldingDING HANYI·Filed 2007·Granted Nov 19, 2013·0 cites·20 claims
- 3450US8237286B2Integrated circuit interconnect structureDING HANYI·Filed 2010·Granted Aug 7, 2012·0 cites·6 claims
- 3547US8643431B2On-chip millimeter wave lange couplerDING HANYI·Filed 2011·Granted Feb 4, 2014·0 cites·11 claims
- 3647US8566759B2Structure for on chip shielding structure for integrated circuits or devices on a substrateDING HANYI·Filed 2008·Granted Oct 22, 2013·0 cites·1 claims
- 3742US8643191B2On-chip radial cavity power divider/combinerDING HANYI·Filed 2012·Granted Feb 4, 2014·0 cites·20 claims
- 3841US8232851B2On-chip millimeter wave lange couplerDING HANYI·Filed 2009·Granted Jul 31, 2012·0 cites·24 claims
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