Assignee
DING YI-CHUAN
TW·2 granted patents·189 citations·filing 2010–2010
Top patents by PatentIndex Score
2 records- 0197US8278746B2Semiconductor device packages including connecting elementsDING YI-CHUAN·Filed 2010·Granted Oct 2, 2012·109 cites·20 claims
- 0296US8624374B2Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereofDING YI-CHUAN·Filed 2010·Granted Jan 7, 2014·80 cites·4 claims
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