Assignee
DO BYUNG TAI
SG·72 granted patents·8 pending applications·286 citations·filing 2006–2014
Top patents by PatentIndex Score
80 records- 0196US8633059B2Integrated circuit packaging system with interconnect and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Jan 21, 2014·23 cites·12 claims
- 0296US8168458B2Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devicesDO BYUNG TAI·Filed 2008·Granted May 1, 2012·37 cites·25 claims
- 0394US8247268B2Semiconductor wafer having through-hole vias on saw streets with backside redistribution layerDO BYUNG TAI·Filed 2010·Granted Aug 21, 2012·16 cites·34 claims
- 0491US8735224B2Integrated circuit packaging system with routed circuit lead array and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted May 27, 2014·10 cites·10 claims
- 0591US8716853B2Extended redistribution layers bumped waferDO BYUNG TAI·Filed 2010·Granted May 6, 2014·10 cites·28 claims
- 0690US8421197B2Integrated circuit package system with warp-free chipDO BYUNG TAI·Filed 2011·Granted Apr 16, 2013·9 cites·10 claims
- 0790US8178956B2Integrated circuit package system for shielding electromagnetic interferenceDO BYUNG TAI·Filed 2007·Granted May 15, 2012·19 cites·20 claims
- 0889US8193610B2Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSPDO BYUNG TAI·Filed 2010·Granted Jun 5, 2012·9 cites·20 claims
- 0988US8937379B1Integrated circuit packaging system with trenched leadframe and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Jan 20, 2015·10 cites·9 claims
- 1086US8519518B2Integrated circuit packaging system with lead encapsulation and method of manufacture thereofDO BYUNG TAI·Filed 2010·Granted Aug 27, 2013·8 cites·16 claims
- 1186US8138024B2Package system for shielding semiconductor dies from electromagnetic interferenceDO BYUNG TAI·Filed 2008·Granted Mar 20, 2012·14 cites·20 claims
- 1286US8084302B2Semiconductor package having semiconductor die with internal vertical interconnect structure and method thereforDO BYUNG TAI·Filed 2008·Granted Dec 27, 2011·10 cites·36 claims
- 1384US8062929B2Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the dieDO BYUNG TAI·Filed 2010·Granted Nov 22, 2011·7 cites·20 claims
- 1482US8623708B1Integrated circuit packaging system with grid-array mechanism and method of manufacture thereofDO BYUNG TAI·Filed 2012·Granted Jan 7, 2014·6 cites·5 claims
- 1580US8080882B2Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the deviceDO BYUNG TAI·Filed 2009·Granted Dec 20, 2011·7 cites·25 claims
- 1679US8779568B2Integrated circuit package system with encapsulation lockDO BYUNG TAI·Filed 2012·Granted Jul 15, 2014·5 cites·8 claims
- 1778US9177897B1Integrated circuit packaging system with trace protection layer and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Nov 3, 2015·4 cites·20 claims
- 1878US8623711B2Integrated circuit packaging system with package-on-package and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Jan 7, 2014·4 cites·8 claims
- 1977US9177848B2Semiconductor wafer having through-hole vias on saw streets with backside redistribution layerDO BYUNG TAI·Filed 2012·Granted Nov 3, 2015·3 cites·20 claims
- 2077US8389330B2Integrated circuit package system with package stand-off and method of manufacture thereofDO BYUNG TAI·Filed 2010·Granted Mar 5, 2013·4 cites·20 claims
- 2176US8546193B2Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structureDO BYUNG TAI·Filed 2010·Granted Oct 1, 2013·3 cites·25 claims
- 2276US8164184B2Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devicesDO BYUNG TAI·Filed 2010·Granted Apr 24, 2012·3 cites·25 claims
- 2375US9123712B1Leadframe system with warp control mechanism and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Sep 1, 2015·3 cites·20 claims
- 2475US8963309B2Semiconductor package with penetrable encapsulant joining semiconductor die and method thereofDO BYUNG TAI·Filed 2011·Granted Feb 24, 2015·3 cites·19 claims
- 2574US8476772B2Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor dieDO BYUNG TAI·Filed 2010·Granted Jul 2, 2013·3 cites·28 claims
- 2674US8309451B2Semiconductor device and method of providing common voltage bus and wire bondable redistributionDO BYUNG TAI·Filed 2008·Granted Nov 13, 2012·5 cites·21 claims
- 2773US9190349B1Integrated circuit packaging system with leadframe and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Nov 17, 2015·3 cites·20 claims
- 2873US9105620B1Integrated circuit packaging system with routable traces and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Aug 11, 2015·3 cites·20 claims
- 2973US8404518B2Integrated circuit packaging system with package stacking and method of manufacture thereofDO BYUNG TAI·Filed 2009·Granted Mar 26, 2013·5 cites·20 claims
- 3072US8445325B2Package-in-package using through-hole via die on saw streetsDO BYUNG TAI·Filed 2007·Granted May 21, 2013·4 cites·38 claims
- 3169US8987064B2Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Mar 24, 2015·2 cites·20 claims
- 3269US8815643B2Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of dieDO BYUNG TAI·Filed 2011·Granted Aug 26, 2014·2 cites·30 claims
- 3369US8629567B2Integrated circuit packaging system with contacts and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Jan 14, 2014·2 cites·10 claims
- 3468US8513788B2Integrated circuit packaging system with pad and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Aug 20, 2013·2 cites·20 claims
- 3567US9312194B2Integrated circuit packaging system with terminals and method of manufacture thereofDO BYUNG TAI·Filed 2012·Granted Apr 12, 2016·2 cites·8 claims
- 3667US8957509B2Integrated circuit packaging system with thermal emission and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Feb 17, 2015·2 cites·7 claims
- 3766US9219029B2Integrated circuit packaging system with terminals and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Dec 22, 2015·2 cites·20 claims
- 3866US8802500B2Integrated circuit packaging system with leads and method of manufacture thereofDO BYUNG TAI·Filed 2010·Granted Aug 12, 2014·3 cites·20 claims
- 3966US8067271B2Integrated circuit package system with encapsulation lockDO BYUNG TAI·Filed 2006·Granted Nov 29, 2011·4 cites·20 claims
- 4064US9048228B2Integrated circuit packaging system with side solderable leads and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Jun 2, 2015·2 cites·20 claims
- 4164US8878361B2Leadless package system having external contactsDO BYUNG TAI·Filed 2011·Granted Nov 4, 2014·1 cites·10 claims
- 4264US8759954B2Integrated circuit package system with offset stacked dieDO BYUNG TAI·Filed 2011·Granted Jun 24, 2014·1 cites·9 claims
- 4364US8729694B2Semiconductor device and method of forming conductive vias with trench in saw streetDO BYUNG TAI·Filed 2011·Granted May 20, 2014·1 cites·31 claims
- 4464US8546195B2Semiconductor package having semiconductor die with internal vertical interconnect structure and method thereforDO BYUNG TAI·Filed 2011·Granted Oct 1, 2013·1 cites·32 claims
- 4563US9147662B1Integrated circuit packaging system with fiber-less substrate and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Sep 29, 2015·1 cites·20 claims
- 4662US8669654B2Integrated circuit packaging system with die paddle and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Mar 11, 2014·1 cites·20 claims
- 4762US8658470B2Integrated circuit packaging system with formed interconnects and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Feb 25, 2014·1 cites·5 claims
- 4862US8633063B2Integrated circuit packaging system with pad connection and method of manufacture thereofDO BYUNG TAI·Filed 2012·Granted Jan 21, 2014·1 cites·10 claims
- 4962US8557638B2Integrated circuit packaging system with pad connection and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Oct 15, 2013·1 cites·10 claims
- 5059US8143102B2Integrated circuit package system including die having relieved active regionDO BYUNG TAI·Filed 2008·Granted Mar 27, 2012·1 cites·20 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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