Assignee
DONGGUAN CHINA ADVANCED CERAMIC TECH CO LTD
CN·3 granted patents·1 citations·filing 2016–2018
Top patents by PatentIndex Score
3 records- 0163US10461016B2Ceramic module for power semiconductor integrated packaging and preparation method thereofDONGGUAN CHINA ADVANCED CERAMIC TECH CO LTD·Filed 2018·Granted Oct 29, 2019·1 cites·10 claims
- 0247US11011450B2Preparation method of a ceramic module for power semiconductor integrated packagingDONGGUAN CHINA ADVANCED CERAMIC TECH CO LTD·Filed 2018·Granted May 18, 2021·0 cites·4 claims
- 0336US10297498B2Method for preparing ceramic package substrate with copper-plated damDONGGUAN CHINA ADVANCED CERAMIC TECH CO LTD·Filed 2016·Granted May 21, 2019·0 cites·7 claims
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