Assignee
DPAC TECHNOLOGIES CORP
US·5 granted patents·353 citations·filing 2001–2002
Top patents by PatentIndex Score
5 records- 0197US6514793B2Stackable flex circuit IC package and method of making sameDPAC TECHNOLOGIES CORP·Filed 2001·Granted Feb 4, 2003·160 cites·6 claims
- 0295US6566746B2Panel stacking of BGA devices to form three-dimensional modulesDPAC TECHNOLOGIES CORP·Filed 2001·Granted May 20, 2003·71 cites·39 claims
- 0391US6660561B2Method of assembling a stackable integrated circuit chipDPAC TECHNOLOGIES CORP·Filed 2002·Granted Dec 9, 2003·74 cites·6 claims
- 0484US6573461B2Retaining ring interconnect used for 3-D stackingDPAC TECHNOLOGIES CORP·Filed 2001·Granted Jun 3, 2003·33 cites·10 claims
- 0572US6573460B2Post in ring interconnect using for 3-D stackingDPAC TECHNOLOGIES CORP·Filed 2001·Granted Jun 3, 2003·15 cites·9 claims
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