Assignee
DUKSAN HI METAL CO LTD
KR·4 granted patents·7 pending applications·1 citations·filing 2013–2024
Top patents by PatentIndex Score
11 records- 0158US2025001529A1Solder alloy, solder joint, and semiconductor package including solder jointDUKSAN HI METAL CO LTD·Filed 2024·Application pending·0 cites
- 0257US10661394B2Metal core solder ball and heat dissipation structure for semiconductor device using the sameDUKSAN HI METAL CO LTD·Filed 2013·Granted May 26, 2020·1 cites·2 claims
- 0353US2025058413A1Solder Paste for Connection PinDUKSAN HI METAL CO LTD·Filed 2023·Application pending·0 cites
- 0451US2025006680A1Solder alloy, solder joint, and semiconductor package including solder jointDUKSAN HI METAL CO LTD·Filed 2024·Application pending·0 cites
- 0546US10651414B2Method of manufacturing metal nanowire and light-transmitting electrode and organic light-emitting device including metal nanowire manufactured therebyDUKSAN HI METAL CO LTD·Filed 2018·Granted May 12, 2020·0 cites·16 claims
- 0646US10636994B2Metal nanowire and light-transmitting electrode and organic light-emitting device including the sameDUKSAN HI METAL CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·22 claims
- 0743US2025062559A1Connection PinDUKSAN HI METAL CO LTD·Filed 2023·Application pending·0 cites
- 0843US2025062200A1Semiconductor PackageDUKSAN HI METAL CO LTD·Filed 2023·Application pending·0 cites
- 0939US10629838B2Core-shell nanowire, method for synthesizing the core-shell nanowire, and transparent electrode and organic light emitting diode including the core-shell nanowireDUKSAN HI METAL CO LTD·Filed 2015·Granted Apr 21, 2020·0 cites·28 claims
- 1038US2024096832A1Connecting pillarDUKSAN HI METAL CO LTD·Filed 2023·Application pending·0 cites
- 1138US2024088079A1Metal pillar for conductive connectionDUKSAN HI METAL CO LTD·Filed 2023·Application pending·0 cites
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