Assignee

DY 4 SYSTEMS LTD

CA·1 granted patent·45 citations·filing 2002–2002

Technology mixH05K1

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1 record

0182US6873528B2Supplemental heat conduction path for card to chassis heat dissipationDY 4 SYSTEMS LTD·Filed 2002·Granted Mar 29, 2005·45 cites·17 claims

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