Assignee
E SENS INC
US·5 granted patents·3 citations·filing 2016–2019
Top patents by PatentIndex Score
5 records- 0181US10464063B2Microfluidics chip with sensor die clamping structuresE SENS INC·Filed 2017·Granted Nov 5, 2019·2 cites·20 claims
- 0273US10359391B2Sensor with a membrane having full circumferential adhesionE SENS INC·Filed 2016·Granted Jul 23, 2019·1 cites·22 claims
- 0368US11331664B2Microfluidics chip with sensor die clamping structuresE SENS INC·Filed 2019·Granted May 17, 2022·0 cites·16 claims
- 0465US11674924B2Sensor with a membrane having full circumferential adhesionE SENS INC·Filed 2019·Granted Jun 13, 2023·0 cites·24 claims
- 0546US10710068B2Microfluidic chip with chemical sensor having back-side contactsE SENS INC·Filed 2017·Granted Jul 14, 2020·0 cites·16 claims
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