Assignee
EGAWA YOSHIMI
JP·6 granted patents·97 citations·filing 2006–2010
Top patents by PatentIndex Score
6 records- 0197US8314492B2Semiconductor package and package-on-package semiconductor deviceEGAWA YOSHIMI·Filed 2010·Granted Nov 20, 2012·83 cites·7 claims
- 0280US8138023B2Method for forming laminated structure and method for manufacturing semiconductor device using the method thereofEGAWA YOSHIMI·Filed 2006·Granted Mar 20, 2012·10 cites·18 claims
- 0362US8202391B2Camera module and method of manufacturing camera moduleEGAWA YOSHIMI·Filed 2009·Granted Jun 19, 2012·2 cites·6 claims
- 0460US8143718B2Semiconductor device having stress relaxation sectionsEGAWA YOSHIMI·Filed 2006·Granted Mar 27, 2012·2 cites·19 claims
- 0546US8500984B2Method for manufacturing printed-circuit boardEGAWA YOSHIMI·Filed 2009·Granted Aug 6, 2013·0 cites·11 claims
- 0646US8435839B2Method of manufacturing semiconductor device and the semiconductor deviceEGAWA YOSHIMI·Filed 2009·Granted May 7, 2013·0 cites·10 claims
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