Assignee
ELECTRONICS PACKAGING SOLUTION
US·2 granted patents·1 pending application·52 citations·filing 2005–2009
Top patents by PatentIndex Score
3 records- 0192US7517712B2Wafer-level hermetic micro-device packagesELECTRONICS PACKAGING SOLUTION·Filed 2005·Granted Apr 14, 2009·27 cites·20 claims
- 0291US7832177B2Insulated glazing unitsELECTRONICS PACKAGING SOLUTION·Filed 2006·Granted Nov 16, 2010·25 cites·35 claims
- 0357US2010119740A1Glass-to-metal bond structureELECTRONICS PACKAGING SOLUTION·Filed 2009·Application pending·0 cites
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