Assignee
ELITE ELECTRONIC MATERIAL KUNSHAN CO LTD
CN·2 granted patents·3 pending applications·0 citations·filing 2012–2013
Top patents by PatentIndex Score
5 records- 0154US9131607B2Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the sameELITE ELECTRONIC MATERIAL KUNSHAN CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·8 claims
- 0241US9288904B2Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the sameELITE ELECTRONIC MATERIAL KUNSHAN CO LTD·Filed 2013·Granted Mar 15, 2016·0 cites·9 claims
- 0338US2014113118A1Halogen-free resin composition and application thereofELITE ELECTRONIC MATERIAL KUNSHAN CO LTD·Filed 2013·Application pending·0 cites
- 0433US2013108875A1Inorganic filler, resin composition, and application thereofELITE ELECTRONIC MATERIAL KUNSHAN CO LTD·Filed 2012·Application pending·0 cites
- 0524US2013105209A1Inorganic filler and electric material containing the sameELITE ELECTRONIC MATERIAL KUNSHAN CO LTD·Filed 2012·Application pending·0 cites
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