Assignee
ELIYAN CORP
US·23 granted patents·89 citations·filing 2022–2024
Top patents by PatentIndex Score
23 records- 0198US11893242B1Multi-chip module (MCM) with multi-port unified memoryELIYAN CORP·Filed 2022·Granted Feb 6, 2024·17 cites·22 claims
- 0298US11855043B1Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substratesELIYAN CORP·Filed 2022·Granted Dec 26, 2023·19 cites·21 claims
- 0398US11841815B1Chiplet gearbox for low-cost multi-chip module applicationsELIYAN CORP·Filed 2023·Granted Dec 12, 2023·18 cites·20 claims
- 0497US12314567B1Multi-chip module (MCM) with multi-port unified memoryELIYAN CORP·Filed 2024·Granted May 27, 2025·2 cites·27 claims
- 0597US12204759B1Multi-chip module (MCM) with multi-port unified memoryELIYAN CORP·Filed 2023·Granted Jan 21, 2025·2 cites·21 claims
- 0696US12190038B1Multi-chip module (MCM) with multi-port unified memoryELIYAN CORP·Filed 2024·Granted Jan 7, 2025·3 cites·34 claims
- 0795US12204794B1Architecture for DRAM control optimization using simultaneous bidirectional memory interfacesELIYAN CORP·Filed 2022·Granted Jan 21, 2025·4 cites·17 claims
- 0892US12058874B1Universal network-attached memory architectureELIYAN CORP·Filed 2023·Granted Aug 6, 2024·1 cites·22 claims
- 0989US12248413B1Universal memory interface utilizing die-to-die (D2D) interfaces between chipletsELIYAN CORP·Filed 2024·Granted Mar 11, 2025·1 cites·24 claims
- 1088US12438095B1Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substratesELIYAN CORP·Filed 2022·Granted Oct 7, 2025·1 cites·20 claims
- 1187US12248419B1Interface conversion circuitry for universal chiplet interconnect express (UCIe)ELIYAN CORP·Filed 2023·Granted Mar 11, 2025·1 cites·19 claims
- 1287US11842986B1Multi-chip module (MCM) with interface adapter circuitryELIYAN CORP·Filed 2022·Granted Dec 12, 2023·20 cites·18 claims
- 1385US12248679B1Multi-chip module (MCM) with multi-port unified memoryELIYAN CORP·Filed 2024·Granted Mar 11, 2025·0 cites·32 claims
- 1485US12204482B1Memory chiplet with efficient mapping of memory-centric interface to die-to-die (D2D) unit interface modulesELIYAN CORP·Filed 2024·Granted Jan 21, 2025·0 cites·20 claims
- 1576US12204840B1Multi-chip module (MCM) with multi-port unified memoryELIYAN CORP·Filed 2024·Granted Jan 21, 2025·0 cites·24 claims
- 1676US12204468B1Universal memory interface with dynamic bidirectional data transfersELIYAN CORP·Filed 2024·Granted Jan 21, 2025·0 cites·20 claims
- 1771US12248421B1Chiplet gearbox for low-cost multi-chip module applicationsELIYAN CORP·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 1868US12524300B1Die-to-die (D2D) interface with cyclic redundancy check (CRC) error correction capabilityELIYAN CORP·Filed 2024·Granted Jan 13, 2026·0 cites·17 claims
- 1965US12494469B1Low cost solution for 2.5D and 3D packaging using USR chipletsELIYAN CORP·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 2060US12525540B1Multi-chip module (MCM) with scalable high bandwidth memoryELIYAN CORP·Filed 2023·Granted Jan 13, 2026·0 cites·19 claims
- 2158US12182040B1Multi-chip module (MCM) with scalable high bandwidth memoryELIYAN CORP·Filed 2023·Granted Dec 31, 2024·0 cites·18 claims
- 2257US12579093B1Chiplet gearbox for low-cost multi-chip module applicationsELIYAN CORP·Filed 2024·Granted Mar 17, 2026·0 cites·20 claims
- 2357US12341569B1Wireline link with crosstalk reduction based on controlled channel delayELIYAN CORP·Filed 2023·Granted Jun 24, 2025·0 cites·19 claims
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