Assignee
ELM TECHNOLOGY CORP
US·40 granted patents·1 pending application·6,899 citations·filing 1994–2004
Top patents by PatentIndex Score
41 records- 0199US7402897B2Vertical system integrationELM TECHNOLOGY CORP·Filed 2003·Granted Jul 22, 2008·349 cites·45 claims
- 0299US7242012B2Lithography device for semiconductor circuit pattern generatorELM TECHNOLOGY CORP·Filed 2003·Granted Jul 10, 2007·294 cites·82 claims
- 0399US6713327B2Stress controlled dielectric integrated circuit fabricationELM TECHNOLOGY CORP·Filed 2001·Granted Mar 30, 2004·154 cites·205 claims
- 0499US6551857B2Three dimensional structure integrated circuitsELM TECHNOLOGY CORP·Filed 2001·Granted Apr 22, 2003·210 cites·131 claims
- 0599US6008126AMembrane dielectric isolation IC fabricationELM TECHNOLOGY CORP·Filed 1998·Granted Dec 28, 1999·431 cites·4 claims
- 0699US5915167AThree dimensional structure memoryELM TECHNOLOGY CORP·Filed 1997·Granted Jun 22, 1999·2.1k cites·73 claims
- 0799US5869354AMethod of making dielectrically isolated integrated circuitELM TECHNOLOGY CORP·Filed 1994·Granted Feb 9, 1999·146 cites·81 claims
- 0898US7474004B2Three dimensional structure memoryELM TECHNOLOGY CORP·Filed 2003·Granted Jan 6, 2009·89 cites·50 claims
- 0998US7193239B2Three dimensional structure integrated circuitELM TECHNOLOGY CORP·Filed 2003·Granted Mar 20, 2007·143 cites·79 claims
- 1098US7138295B2Method of information processing using three dimensional integrated circuitsELM TECHNOLOGY CORP·Filed 2003·Granted Nov 21, 2006·87 cites·220 claims
- 1198US6682981B2Stress controlled dielectric integrated circuit fabricationELM TECHNOLOGY CORP·Filed 2001·Granted Jan 27, 2004·77 cites·70 claims
- 1298US6563224B2Three dimensional structure integrated circuitELM TECHNOLOGY CORP·Filed 2002·Granted May 13, 2003·119 cites·4 claims
- 1398US6133640AThree-dimensional structure memoryELM TECHNOLOGY CORP·Filed 1997·Granted Oct 17, 2000·243 cites·36 claims
- 1498US5946559AMembrane dielectric isolation IC fabricationELM TECHNOLOGY CORP·Filed 1995·Granted Aug 31, 1999·292 cites·10 claims
- 1598US5840593AMembrane dielectric isolation IC fabricationELM TECHNOLOGY CORP·Filed 1997·Granted Nov 24, 1998·307 cites·2 claims
- 1697US7705466B2Three dimensional multi layer memory and control logic integrated circuit structureELM TECHNOLOGY CORP·Filed 2003·Granted Apr 27, 2010·84 cites·130 claims
- 1797US7504732B2Three dimensional structure memoryELM TECHNOLOGY CORP·Filed 2002·Granted Mar 17, 2009·77 cites·68 claims
- 1897US6765279B2Membrane 3D IC fabricationELM TECHNOLOGY CORP·Filed 2001·Granted Jul 20, 2004·95 cites·15 claims
- 1997US6632706B1Three dimensional structure integrated circuit fabrication processELM TECHNOLOGY CORP·Filed 2000·Granted Oct 14, 2003·96 cites·35 claims
- 2097US5725995AMethod of repairing defective traces in an integrated circuit structureELM TECHNOLOGY CORP·Filed 1995·Granted Mar 10, 1998·177 cites·8 claims
- 2197US5654220AMethod of making a stacked 3D integrated circuit structureELM TECHNOLOGY CORP·Filed 1995·Granted Aug 5, 1997·165 cites·6 claims
- 2297US5633209AMethod of forming a circuit membrane with a polysilicon filmELM TECHNOLOGY CORP·Filed 1995·Granted May 27, 1997·89 cites·1 claims
- 2396US7485571B2Method of making an integrated circuitELM TECHNOLOGY CORP·Filed 2003·Granted Feb 3, 2009·36 cites·198 claims
- 2496US6288561B1Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatusELM TECHNOLOGY CORP·Filed 1995·Granted Sep 11, 2001·113 cites·86 claims
- 2596US5985693AHigh density three-dimensional IC interconnectionELM TECHNOLOGY CORP·Filed 1997·Granted Nov 16, 1999·218 cites·20 claims
- 2695US6838896B2Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatusELM TECHNOLOGY CORP·Filed 2001·Granted Jan 4, 2005·54 cites·18 claims
- 2795US5629137AMethod of repairing an integrated circuit structureELM TECHNOLOGY CORP·Filed 1995·Granted May 13, 1997·121 cites·14 claims
- 2894US7479694B2Membrane 3D IC fabricationELM TECHNOLOGY CORP·Filed 2003·Granted Jan 20, 2009·28 cites·21 claims
- 2994US6020257AMembrane dielectric isolation IC fabricationELM TECHNOLOGY CORP·Filed 1997·Granted Feb 1, 2000·117 cites·16 claims
- 3093US5654127AMethod of making a tester surface with high density probe pointsELM TECHNOLOGY CORP·Filed 1995·Granted Aug 5, 1997·97 cites·16 claims
- 3192US7550805B2Stress-controlled dielectric integrated circuitELM TECHNOLOGY CORP·Filed 2003·Granted Jun 23, 2009·21 cites·200 claims
- 3292US7307020B2Membrane 3D IC fabricationELM TECHNOLOGY CORP·Filed 2003·Granted Dec 11, 2007·21 cites·158 claims
- 3392US5834334AMethod of forming a multi-chip module from a membrane circuitELM TECHNOLOGY CORP·Filed 1995·Granted Nov 10, 1998·71 cites·15 claims
- 3492US5637907AThree dimensional semiconductor circuit structure with optical interconnectionELM TECHNOLOGY CORP·Filed 1995·Granted Jun 10, 1997·71 cites·5 claims
- 3590US6891387B2System for probing, testing, burn-in, repairing and programming of integrated circuitsELM TECHNOLOGY CORP·Filed 2004·Granted May 10, 2005·29 cites·17 claims
- 3689US7385835B2Membrane 3D IC fabricationELM TECHNOLOGY CORP·Filed 2003·Granted Jun 10, 2008·31 cites·23 claims
- 3783US7176545B2Apparatus and methods for maskless pattern generationELM TECHNOLOGY CORP·Filed 2004·Granted Feb 13, 2007·14 cites·42 claims
- 3880US8035233B2Adjacent substantially flexible substrates having integrated circuits that are bonded together by non-polymeric layerELM TECHNOLOGY CORP·Filed 2003·Granted Oct 11, 2011·11 cites·35 claims
- 3980US6714625B1Lithography device for semiconductor circuit pattern generationELM TECHNOLOGY CORP·Filed 1995·Granted Mar 30, 2004·46 cites·6 claims
- 4074US7223696B2Methods for maskless lithographyELM TECHNOLOGY CORP·Filed 2004·Granted May 29, 2007·19 cites·44 claims
- 4142US2002132465A1Reconfigurable integrated circuit memoryELM TECHNOLOGY CORP·Filed 2002·Application pending·0 cites
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