Assignee
ELPAC USA INC
US·2 granted patents·103 citations·filing 1997–1999
Top patents by PatentIndex Score
2 records- 0181US6219253B1Molded electronic package, method of preparation using build up technology and method of shieldingELPAC USA INC·Filed 1999·Granted Apr 17, 2001·70 cites·23 claims
- 0269US6160714AMolded electronic package and method of preparationELPAC USA INC·Filed 1997·Granted Dec 12, 2000·33 cites·40 claims
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