Assignee
ENDO TADASUKE
JP·2 granted patents·1 pending application·2 citations·filing 2008–2009
Top patents by PatentIndex Score
3 records- 0163US8465837B2Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring boardENDO TADASUKE·Filed 2008·Granted Jun 18, 2013·2 cites·22 claims
- 0241US8294268B2Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor deviceENDO TADASUKE·Filed 2008·Granted Oct 23, 2012·0 cites·10 claims
- 0334US2011205721A1Resin composition, resin sheet, prepreg, laminate, multilayer printed wiring board, and semiconductor deviceENDO TADASUKE·Filed 2009·Application pending·0 cites
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