Assignee
ENDOH KEIICHI
JP·4 granted patents·13 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0182US8641929B2Low-temperature-sinterable bonding material, and bonding method using the bonding materialENDOH KEIICHI·Filed 2011·Granted Feb 4, 2014·9 cites·8 claims
- 0266US9533380B2Bonding material and bonding method in which said bonding material is usedENDOH KEIICHI·Filed 2012·Granted Jan 3, 2017·2 cites·8 claims
- 0360US9240256B2Bonding material and bonding method using the sameENDOH KEIICHI·Filed 2010·Granted Jan 19, 2016·1 cites·4 claims
- 0455US8858700B2Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding methodENDOH KEIICHI·Filed 2009·Granted Oct 14, 2014·1 cites·7 claims
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