Assignee
EO TECHNICS CO LTD
KR·22 granted patents·7 pending applications·55 citations·filing 2002–2025
Top patents by PatentIndex Score
29 records- 0186US10286485B2Laser processing device and laser processing methodEO TECHNICS CO LTD·Filed 2016·Granted May 14, 2019·4 cites·21 claims
- 0277US2025332661A1Variable-pulse-width flat-top laser device and operating method thereforEO TECHNICS CO LTD·Filed 2025·Application pending·0 cites
- 0376US12214442B2Variable-pulse-width flat-top laser device and operating method thereforEO TECHNICS CO LTD·Filed 2024·Granted Feb 4, 2025·0 cites·18 claims
- 0471US2024006648A1Device for manufacturing electrodeEO TECHNICS CO LTD·Filed 2023·Application pending·0 cites
- 0567US6808117B2Method and apparatus for calibrating marking position in chip scale markerEO TECHNICS CO LTD·Filed 2002·Granted Oct 26, 2004·19 cites·25 claims
- 0665US7672344B2Multi-laser systemEO TECHNICS CO LTD·Filed 2008·Granted Mar 2, 2010·3 cites·8 claims
- 0763US12370625B2Variable-pulse-width flat-top laser device and operating method thereforEO TECHNICS CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·12 claims
- 0863US10861725B2Laser marking device and laser marking methodEO TECHNICS CO LTD·Filed 2016·Granted Dec 8, 2020·1 cites·15 claims
- 0963US2022297237A1Device for manufacturing electrodeEO TECHNICS CO LTD·Filed 2022·Application pending·0 cites
- 1062US11478828B2Adhesive removing device and methodEO TECHNICS CO LTD·Filed 2016·Granted Oct 25, 2022·1 cites·14 claims
- 1162US2025135584A1Groove forming apparatusEO TECHNICS CO LTD·Filed 2022·Application pending·0 cites
- 1261US11621184B2Laser marking device and laser marking methodEO TECHNICS CO LTD·Filed 2020·Granted Apr 4, 2023·0 cites·18 claims
- 1360US6710286B2Chip scale marker and making methodEO TECHNICS CO LTD·Filed 2002·Granted Mar 23, 2004·11 cites·23 claims
- 1457US7713780B2Method of multi-processing object using polygon mirrorEO TECHNICS CO LTD·Filed 2007·Granted May 11, 2010·1 cites·13 claims
- 1550US7164519B2Laser processing apparatus and method using polygon mirrorEO TECHNICS CO LTD·Filed 2004·Granted Jan 16, 2007·5 cites·4 claims
- 1649US6870127B2Chip scale marker and marking methodEO TECHNICS CO LTD·Filed 2003·Granted Mar 22, 2005·4 cites·27 claims
- 1748US6794205B2Chip scale marker and method of calibrating marking positionEO TECHNICS CO LTD·Filed 2003·Granted Sep 21, 2004·3 cites·17 claims
- 1844US7688492B2Laser processing apparatusEO TECHNICS CO LTD·Filed 2004·Granted Mar 30, 2010·3 cites·11 claims
- 1943US10290525B2Marking method for wafer diceEO TECHNICS CO LTD·Filed 2014·Granted May 14, 2019·0 cites·11 claims
- 2042US11065805B2Warpage reduction device and warpage reduction methodEO TECHNICS CO LTD·Filed 2018·Granted Jul 20, 2021·0 cites·17 claims
- 2142US10304778B2Wafer marking methodEO TECHNICS CO LTD·Filed 2014·Granted May 28, 2019·0 cites·6 claims
- 2241US2007138154A1Method of forming via hole using laser beamEO TECHNICS CO LTD·Filed 2006·Application pending·0 cites
- 2338US7688877B2Laser machining apparatusEO TECHNICS CO LTD·Filed 2008·Granted Mar 30, 2010·0 cites·8 claims
- 2437US7126083B2Chip scale marker and method of calibrating marking positionEO TECHNICS CO LTD·Filed 2004·Granted Oct 24, 2006·0 cites·15 claims
- 2536US10770298B2Automatic inspection device and method of laser processing equipmentEO TECHNICS CO LTD·Filed 2016·Granted Sep 8, 2020·0 cites·20 claims
- 2635US10867828B2Marking position correcting apparatus and methodEO TECHNICS CO LTD·Filed 2016·Granted Dec 15, 2020·0 cites·18 claims
- 2735US2017259372A1Laser welding apparatus capable of performing bellows weldingEO TECHNICS CO LTD·Filed 2016·Application pending·0 cites
- 2833US2004101000A1Laser system for dual wavelength and chip scale marker having the sameEO TECHNICS CO LTD·Filed 2003·Application pending·0 cites
- 2932US10134681B2Laser processing method for cutting semiconductor wafer having metal layer formed thereon and laser processing deviceEO TECHNICS CO LTD·Filed 2015·Granted Nov 20, 2018·0 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →