Assignee

EPM AG

CH·2 granted patents·29 citations·filing 1978–1988

Technology mixH05K2 B23K1 Y10S1 Y10T1

Top patents by PatentIndex Score

2 records

0167US4807794AMethod and equipment to solder printed-circuit assembliesEPM AG·Filed 1988·Granted Feb 28, 1989·23 cites·12 claims
0237US4173160AMachine for cutting the lead ends of components mounted at printed-wiring boardsEPM AG·Filed 1978·Granted Nov 6, 1979·6 cites·16 claims

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