Assignee
EPWORKS CO LTD
KR·1 granted patent·2 pending applications·8 citations·filing 2005–2011
Top patents by PatentIndex Score
3 records- 0172US7264995B2Method for manufacturing wafer level chip scale package using redistribution substrateEPWORKS CO LTD·Filed 2005·Granted Sep 4, 2007·8 cites·24 claims
- 0247US2010193903A1Three dimensional semiconductor device, method of manufacturing the same and electrical cutoff method for using fuse pattern of the sameEPWORKS CO LTD·Filed 2008·Application pending·0 cites
- 0334US2011272729A1Wafer level led interposerEPWORKS CO LTD·Filed 2011·Application pending·0 cites
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