Assignee
ERICKSON BRIAN D
US·2 granted patents·3 citations·filing 2013–2016
Technology mixG01R2
Top patents by PatentIndex Score
2 records- 0180US9903910B2Method for testing through-silicon vias at wafer sort using electron beam deflectionERICKSON BRIAN D·Filed 2016·Granted Feb 27, 2018·2 cites·11 claims
- 0262US9529041B2Method for testing through-silicon vias at wafer sort using electron beam deflectionERICKSON BRIAN D·Filed 2013·Granted Dec 27, 2016·1 cites·10 claims
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