Assignee
EUPEC GMBH & CO KG
DE·31 granted patents·631 citations·filing 1987–2005
Top patents by PatentIndex Score
31 records- 0191US6696705B1Power semiconductor component having a mesa edge terminationEUPEC GMBH & CO KG·Filed 2000·Granted Feb 24, 2004·69 cites·11 claims
- 0289US6693327B2Lateral semiconductor component in thin-film SOI technologyEUPEC GMBH & CO KG·Filed 2002·Granted Feb 17, 2004·170 cites·15 claims
- 0382US6431259B2Spring clip for fixing semiconductor modules to a heat sinkEUPEC GMBH & CO KG·Filed 2001·Granted Aug 13, 2002·63 cites·6 claims
- 0478US7034395B2Power semiconductor module with cooling element and pressing apparatusEUPEC GMBH & CO KG·Filed 2004·Granted Apr 25, 2006·25 cites·19 claims
- 0575US7315439B2Method and circuit arrangement for limiting an overvoltageEUPEC GMBH & CO KG·Filed 2004·Granted Jan 1, 2008·18 cites·9 claims
- 0671US5508560ASemiconductor moduleEUPEC GMBH & CO KG·Filed 1994·Granted Apr 16, 1996·53 cites·5 claims
- 0769US7279963B2Low inductance semiconductor device having half-bridge configurationEUPEC GMBH & CO KG·Filed 2005·Granted Oct 9, 2007·8 cites·20 claims
- 0869US6043516ASemiconductor component with scattering centers within a lateral resistor regionEUPEC GMBH & CO KG·Filed 1997·Granted Mar 28, 2000·36 cites·13 claims
- 0968US6597585B2Power semiconductor moduleEUPEC GMBH & CO KG·Filed 2001·Granted Jul 22, 2003·20 cites·18 claims
- 1067US7319196B2Bonding wire and bonded connectionEUPEC GMBH & CO KG·Filed 2005·Granted Jan 15, 2008·7 cites·22 claims
- 1167US7221004B2Semiconductor moduleEUPEC GMBH & CO KG·Filed 2005·Granted May 22, 2007·6 cites·19 claims
- 1263US6835994B2Power semiconductor moduleEUPEC GMBH & CO KG·Filed 2002·Granted Dec 28, 2004·13 cites·16 claims
- 1362US6809411B2Low-inductance semiconductor componentsEUPEC GMBH & CO KG·Filed 2001·Granted Oct 26, 2004·16 cites·6 claims
- 1462US5063428ASemiconductor element having a p-zone on the anode side and an adjacent, weakly doped n-base zoneEUPEC GMBH & CO KG·Filed 1987·Granted Nov 5, 1991·20 cites·20 claims
- 1560US6660569B1Method for producing a power semiconductor device with a stop zoneEUPEC GMBH & CO KG·Filed 1999·Granted Dec 9, 2003·18 cites·14 claims
- 1658US6802745B2Housing for accomodating a power semiconductor module and contact element for use in the housingEUPEC GMBH & CO KG·Filed 2002·Granted Oct 12, 2004·10 cites·29 claims
- 1754US6828600B2Power semiconductor module with ceramic substrateEUPEC GMBH & CO KG·Filed 2003·Granted Dec 7, 2004·8 cites·4 claims
- 1851US7212063B2Half-bridge circuit with phase outputEUPEC GMBH & CO KG·Filed 2004·Granted May 1, 2007·11 cites·11 claims
- 1950US7319250B2Semiconductor component and method for producing the sameEUPEC GMBH & CO KG·Filed 2005·Granted Jan 15, 2008·0 cites·14 claims
- 2050US5617293ABridge moduleEUPEC GMBH & CO KG·Filed 1995·Granted Apr 1, 1997·19 cites·5 claims
- 2149US6054727APower semiconductor componentEUPEC GMBH & CO KG·Filed 1995·Granted Apr 25, 2000·15 cites·6 claims
- 2248US7078795B2High voltage module and method for producing sameEUPEC GMBH & CO KG·Filed 2003·Granted Jul 18, 2006·3 cites·15 claims
- 2346US6715203B2Substrate for power semiconductor modules with through-plating of solder and method for its productionEUPEC GMBH & CO KG·Filed 2001·Granted Apr 6, 2004·3 cites·7 claims
- 2443US7151318B2Semiconductor component and method for contacting said semiconductor componentEUPEC GMBH & CO KG·Filed 2004·Granted Dec 19, 2006·0 cites·20 claims
- 2540US6858807B2Substrate for receiving a circuit configuration and method for producing the substrateEUPEC GMBH & CO KG·Filed 2002·Granted Feb 22, 2005·2 cites·22 claims
- 2636US5773858APower diodeEUPEC GMBH & CO KG·Filed 1993·Granted Jun 30, 1998·7 cites·14 claims
- 2735US6914296B2Controllable semiconductor component with multi-section control electrodeEUPEC GMBH & CO KG·Filed 2003·Granted Jul 5, 2005·0 cites·15 claims
- 2833US6861741B2Circuit configurationEUPEC GMBH & CO KG·Filed 2002·Granted Mar 1, 2005·0 cites·18 claims
- 2931US7147520B2Connection part and method for producing a connection partEUPEC GMBH & CO KG·Filed 2005·Granted Dec 12, 2006·2 cites·9 claims
- 3027US5310701AMethod for fixing semiconductor bodies on a substrate using wiresEUPEC GMBH & CO KG·Filed 1993·Granted May 10, 1994·9 cites·6 claims
- 3122US6943418B2Insulating elementEUPEC GMBH & CO KG·Filed 2003·Granted Sep 13, 2005·0 cites·12 claims
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