Assignee
EXPRESS PACKAGING SYSTEMS INC
US·3 granted patents·611 citations·filing 1997–1999
Top patents by PatentIndex Score
3 records- 0198US6075710ALow-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chipsEXPRESS PACKAGING SYSTEMS INC·Filed 1999·Granted Jun 13, 2000·252 cites·14 claims
- 0294US6057601AHeat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrateEXPRESS PACKAGING SYSTEMS INC·Filed 1998·Granted May 2, 2000·242 cites·20 claims
- 0390US5825084ASingle-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devicesEXPRESS PACKAGING SYSTEMS INC·Filed 1997·Granted Oct 20, 1998·117 cites·22 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →